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? semiconductor components industries, llc, 2004 november, 2004 ? rev. 7 1 publication order number: ncp2809/d ncp2809 series nocap 135 mw stereo headphone power amplifier the ncp2809 is a cost?effective stereo audio power amplifier capable of delivering 135 mw of continuous average power per channel into 16 loads. the ncp2809 audio power amplifier is specifically designed to provide high quality output power from low supply voltage, requiring very few external components. since ncp2809 does not require bootstrap capacitors or snubber networks, it is optimally suited for low?power portable systems. ncp2809a has an internal gain of 0 db while specific external gain can externally be set with ncp2809b. if the application allows it, the virtual ground provided by the device can be connected to the middle point of the headset (figure 1). in such case, the two external heavy coupling capacitors typically used can be removed. otherwise, you can also use both outputs in single ended mode with external coupling capacitors (figure 43). due to its excellent power supply rejection ratio (psrr), it can be directly connected to the battery, saving the use of an ldo. features ? pb?free package is available ? 135 mw to a 16 load from a 5.0 v power supply ? excellent psrr (85 db typical): direct connection to the battery ? apop and clicko noise protection circuit ? ultra low current shutdown mode ? 2.2 v5.5 v operation ? outstanding total harmonics distortion + noise (thd+n): less than 0.01% ? external turn?on and turn?off configuration capability ? thermal overload protection circuitry typical applications ? cellular phone ? portable stereo ? mp3 player ? personal and notebook computers micro10 dm suffix case 846b 1 10 pin connections in_r out_r sd byp ref_i v m v p 110 2 3 4 9 8 7 x = e for ncp2809a marking diagram max in_l 5 out_l 6 ayw x = c for ncp2809b a = assembly location y = year w = work week out_i see detailed ordering and shipping information in the package dimensions section on page 20 of this data sheet. ordering information http://onsemi.com
ncp2809 series http://onsemi.com 2 figure 1. ncp2809a typical application schematic without output coupling capacitor (nocap configuration) + - + - + - out_l out_i ref_i out_r 20 k 20 k bypass 1 fc s v p v p shutdown control 20 k 20 k v m 1 f c bypass v p v mc bridge bypass shutdown in_r in_l 390 nf c i 390 nf c i v ih v il audio input audio input figure 2. ncp2809a typical application schematic with output coupling capacitor + - + - + - out_l out_i ref_i out_r bypass 1 fc s v p v p shutdown control 20 k 20 k v m 1 f v p v mc bridge bypass shutdown in_r in_l 390 nf c i 390 nf c i v ih v il audio input audio input left right sleeve headphone jack left right sleeve headphone jack 20 k 20 k nc nc 220 f c out 220 f c out + + tip (left) ring (right) sleeve figure 3. typical 3?wire headphone plug
ncp2809 series http://onsemi.com 3 figure 4. ncp2809b typical application schematic without output coupling capacitor (nocap configuration) + - + - + - out_l out_i ref_i out_r bypass 1 fc s v p v p shutdown control v m 1 f c bypass v p v mc bridge bypass shutdown in_r in_l 390 nf c i 390 nf c i v ih v il audio input audio input figure 5. ncp2809b typical application schematic with output coupling capacitor + - + - + - out_l out_i ref_i out_r bypass 1 fc s v p v p shutdown control v m 1 f v p v mc bridge bypass shutdown in_r in_l 390 nf c i 390 nf c i v ih v il left right sleeve headphone jack left right sleeve headphone jack nc nc 220 f c out 220 f c out + + 20 k 20 k 20 k 20 k 20 k 20 k c bypass 20 k 20 k audio input audio input
ncp2809 series http://onsemi.com 4 pin function description pin type symbol description 1 i in_r negative input of the second amplifier. it receives the audio input signal. connected to the input capicator c in (ncp2809a) or the external r in (ncp2809b). 2 i shutdown the device enters in shutdown mode when a a low level is applied on this pin. 3 i bypass bypass capacitor pin which provides the common mode voltage (v p /2). 4 o ref_i virtual ground amplifier feed back. this pin sets the stereo headset ground. in order to improve crosstalk, this pin must be connected as close as possible to the ground connection of the headset (ideally at the ground pin of the headset connector). when one uses bypassing capacitors, this pin must be left unconnected. 5 i in_l negative input of the first amplifier. it receives the audio input signal. connected to the input capacitor c in (ncp2809a) or the external r in (ncp2809b). 6 o out_l stereo headset amplifier analog output left. this pin will output the amplified analog signal and, depending on the application, must be coupled with a capacitor or directly connected to the left loudspeaker of the headset. this output is able to drive a 16 load in a single?ended configuration. 7 i v p positive analog supply of the cell. range: 2.2 v 5.5 v 8 o out_i virtual ground for stereo headset common connection. this pin is directly connected to the common connection of the headset when use of bypassing capacitor is not required. when one uses bypassing capacitors, this pin must be left unconnected. 9 i v m analog ground 10 o out_r stereo headset amplifier analog output right. this pin will output the amplified analog signal and, depending on the application, must be coupled with a capacitor or directly connected to the right loudspeaker of the headset. this output is able to drive a 16 load in a single?ended configuration. maximum ratings (t a = +25 c) rating symbol value unit supply voltage v p 6.0 v operating supply voltage o p v p 2.2 to 5.5 v input v oltage v in ?0.3 to v cc + 0.3 v max output current i out 250 ma power dissipation p d internally limited ? operating ambient t emperature t a ?40 to +85 c max junction temperature t j 150 c storage temperature range t stg ?65 to +150 c thermal resistance, junction?to?air micro10 r ja 200 c/w esd protection human body model (hbm) (note 1) machine model (mm) (note 2) ? 8000 200 v latch up current at ta = 85 c (note 3) 100 ma maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneo usly. if stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected. functional operation should be restricted to the recommended operating conditions. 1. human body model, 100 pf discharged through a 1.5 k resistor following specification jesd22/a114 8.0 kv can be applied on out_l, out_r, ref_i and out_i outputs. for other pins, 2.0 kv is the specified voltage. 2. machine model, 200 pf discharged through all pins following specification jesd22/a115. 3. maximum ratings per jedec standard jesd78. *this device contains 752 active transistors and 1740 mos gates.
ncp2809 series http://onsemi.com 5 electrical characteristics all the parameters are given in the capless configuration (typical application). the following parameters are given for the ncp2809a and ncp2809b mounted externally with 0 db gain, unless otherwise noted. (for typical values t a = 25 c, for min and max values t a = ?40 c to 85 c, t jmax = 125 c, unless otherwise noted.) characteristic symbol conditions min (note 4) typ max (note 4) unit supply quiescent current i dd v in = 0 v, r l = 16 v p = 2.4 v v p = 5.0 v 1.54 1.84 2.8 3.6 ma output offset voltage v off v p = 2.4 v v p = 5.0 v ?25 1.0 +25 mv shutdown current i sd v p = 5.0 v 10 600 na shutdown voltage high (note 5) v sdih ? 1.2 v shutdown voltage low v sdil ? 0.4 v turning on time (note 6) t wu c by = 1.0 f 285 ms turning off time (note 6) t sd c by = 1.0 f and v p = 5.0 v 385 ms max output swing v loadpeak v p = 2.4 v, r l = 16 v p = 5.0 v, r l = 16 v p = 2.4 v, r l = 32 v p = 5.0 v, r l = 32 0.82 1.94 0.9 2.05 1.04 2.26 v max rms output power p orms v p = 2.4 v, r l = 16 , thd+n<0.1% v p = 5.0 v, r l = 16 , thd+n<0.1% v p = 2.4 v, r l = 32 , thd+n<0.1% v p = 5.0 v, r l = 32 , thd+n<0.1% 24 131 17 80 mw voltage gain g ncp2809a only ?0.5 0 +0.5 db crosstalk cs f = 1.0 khz v p = 2.4 v, r l = 16 , p out = 20 mw v p = 2.4 v, r l = 32 , p out = 10 mw v p = 3.0 v, r l = 16 , p out = 30 mw v p = 3.0 v, r l = 32 , p out = 20 mw v p = 5.0 v, r l = 16 , p out = 75 mw v p = 5.0 v, r l = 32 , p out = 50 mw ?63.5 ?72.5 ?64 ?73 ?64 ?73 db signal to noise ratio snr f = 1.0 khz v p = 2.4 v, r l = 16 , p out = 20 mw v p = 2.4 v, r l = 32 , p out = 10 mw v p = 3.0 v, r l = 16 , p out = 30 mw v p = 3.0 v, r l = 32 , p out = 20 mw v p = 5.0 v, r l = 16 , p out = 75 mw v p = 5.0 v, r l = 32 , p out = 50 mw 88.3 89 90.5 92 95.1 96.1 db 4. min/max limits are guaranteed by production test. 5. at t a = ?40 c, the minimum value is set to 1.5 v. 6. see page 10 for a theoretical approach to these parameters.
ncp2809 series http://onsemi.com 6 electrical characteristics all the parameters are given in the capless configuration (typical application). the following parameters are given for the ncp2809a and ncp2809b mounted externally with 0 db gain, unless otherwise noted. (for typical values t a = 25 c, for min and max values t a = ?40 c to 85 c, t jmax = 125 c, unless otherwise noted.) characteristic symbol conditions min (note 7) typ max (note 7) unit positive supply rejection ratio psrr v+ r l = 16 v pripple_pp = 200 mv c by = 1.0 f input terminated with 10 ncp2809a f = 217 hz v p = 5.0 v v p = 2.4 v f = 1.0 khz v p = 5.0 v v p = 2.4 v ?73 ?82 ?73 ?85 db positive supply rejection ratio psrr v+ r l = 16 v pripple_pp = 200 mv c by = 1.0 f input terminated with 10 ncp2809b with 0 db external gain f = 217 hz v p = 5.0 v v p = 2.4 v f = 1.0 khz v p = 5.0 v v p = 2.4 v ?80 ?82 ?81 ?81 db efficiency v p = 5.0 v, r l = 16 = 135 mw 63 % thermal shutdown t emperature (note 8) t sd ? 160 c total harmonic distortion + noise (note 9) thd+n v p = 2.4 v, f = 1.0 khz r l = 16 , p out = 20 mw r l = 32 , p out = 15 mw v p = 5.0 v, f = 1.0 khz r l = 16 , p out = 120 mw r l = 32 , p out = 70 mw 0.006 0.004 0.005 0.003 % 7. min/max limits are guaranteed by production test. 8. this thermal shutdown is made with an hysteresis function. typically, the device turns off at 160 c and turns on again when the junction temperature is less than 140 c. 9. the outputs of the device are sensitive to a coupling capacitor to ground. to ensure thd+n at very low level for any sort of headset (16 or 32 , outputs (out_r, out_l, out_i and ref_i) must not be grounded with more than 500 pf.
ncp2809 series http://onsemi.com 7 typical characteristics 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) thd+n (%) 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) thd+n (%) 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) thd+n (%) 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) thd+n (%) 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) thd+n (%) figure 6. thd+n vs. frequency v p = 5.0 v, r l = 16 , p out = 75 mw 0.001 0.01 0.1 1 10 10 100 1000 10000 100000 frequency (hz) thd+n (%) figure 7. thd+n vs. frequency v p = 5.0 v, r l = 32 , p out = 50 mw figure 8. thd+n vs. frequency v p = 3.0 v, r l = 16 , p out = 30 mw figure 9. thd+n vs. frequency v p = 3.0 v, r l = 32 , p out = 20 mw figure 10. thd+n vs. frequency v p = 2.4 v, r l = 16 , p out = 20 mw figure 11. thd+n vs. frequency v p = 2.4 v, r l = 32 , p out = 10 mw
ncp2809 series http://onsemi.com 8 typical characteristics 0.001 0.01 0.1 1 10 thd+n (%) output power (mw) 10 30 40 50 020 0.001 0.01 0.1 1 10 thd+n (%) output power (mw) 10 20 30 35 0 51525 0.001 0.01 0.1 1 10 thd+n (%) output power (mw) 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 160 figure 12. thd+n vs. power out v p = 5.0 v, r l = 16 , 1.0 khz figure 13. thd+n vs. power out v p = 5.0 v, r l = 32 , 1.0 khz 0 102030405060708090 figure 14. thd+n vs. power out v p = 3.3 v, r l = 16 , 1.0 khz figure 15. thd+n vs. power out v p = 3.3 v, r l = 32 , 1.0 khz 10 20 30 40 figure 16. thd+n vs. power out v p = 3.0 v, r l = 16 , 1.0 khz figure 17. thd+n vs. power out v p = 3.0 v, r l = 32 , 1.0 khz thd+n (%) output power (mw) 0.001 0.01 0.1 1 10 0 thd+n (%) output power (mw) 0.001 0.01 0.1 1 10 thd+n (%) output power (mw) 0 10 30 40 50 020 60
ncp2809 series http://onsemi.com 9 typical characteristics crosstalk (db) frequency (hz) ?80 ?70 ?60 ?50 ?40 10 100 1000 10000 100000 crosstalk (db) frequency (hz) 0.001 0.01 0.1 1 10 thd+n (%) output power (mw) 0 5 10 15 20 0.001 0.01 0.1 1 10 thd+n (%) output power (mw) 0 5 10 15 20 25 30 ?80 ?70 ?60 ?50 ?40 10 100 1000 10000 100000 crosstalk (db) frequency (hz) ?80 ?70 ?60 ?50 ?40 10 100 1000 10000 100000 crosstalk (db) frequency (hz) ?80 ?70 ?60 ?50 ?40 10 100 1000 10000 100000 figure 18. thd+n vs. power out v p = 2.4 v, r l = 16 , 1.0 khz figure 19. thd+n vs. power out v p = 2.4 v, r l = 3.2 , 1.0 khz figure 20. crosstalk v p = 5.0 v, r l = 16 , p out = 75 mw figure 21. crosstalk v p = 5.0 v, r l = 32 , p out = 50 mw figure 22. crosstalk v p = 3.0 v, r l = 16 , p out = 30 mw figure 23. crosstalk v p = 3.0 v, r l = 32 , p out = 20 mw
ncp2809 series http://onsemi.com 10 typical characteristics ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 figure 24. crosstalk v p = 2.4 v, r l = 16 , p out = 20 mw figure 25. crosstalk v p = 2.4 v, r l = 32 , p out = 10 mw ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 figure 26. psrr ? input grounded with 10 v p = 2.4 v, v ripple = 200 mv pk?pk, r l =16 crosstalk (db) frequency (hz) ?80 ?70 ?60 ?50 ?40 10 100 1000 10000 100000 crosstalk (db) frequency (hz) ?80 ?70 ?60 ?50 ?40 10 100 1000 10000 100000 psrr (db) frequency (hz) 10 100 1000 10000 100000 figure 27. psrr ? input grounded with 10 v p = 2.4 v, v ripple = 200 mv pk?pk, r l = 32 figure 28. psrr ? input grounded with 10 v p = 3.0 v, v ripple = 200 mv pk?pk, r l =16 figure 29. psrr ? input grounded with 10 v p =3.0 v, v ripple = 200 mv pk?pk, r l = 32 ncp2809a ncp2809a ncp2809a ncp2809a
ncp2809 series http://onsemi.com 11 typical characteristics ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 figure 30. psrr ? input grounded with 10 v p = 3.3 v, v ripple = 200 mv pk?pk, r l =16 figure 31. psrr ? input grounded with 10 v p = 3.3 v, v ripple = 200 mv pk?pk, r l = 32 figure 32. psrr ? input grounded with 10 v p = 5.0 v, v ripple = 200 mv pk?pk, r l =16 figure 33. psrr ? input grounded with 10 v p = 5.0 v, v ripple = 200 mv pk?pk, r l = 32 ncp2809a ncp2809a ncp2809a ncp2809a
ncp2809 series http://onsemi.com 12 typical characteristics ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 psrr (db) frequency (hz) 10 100 1000 10000 100000 figure 34. psrr ? input grounded with 10 v p = 2.4 v, v ripple = 200 mv pk?pk, r l =16 , g = 1 (0 db) figure 35. psrr ? input grounded with 10 v p = 5.0 v, v ripple = 200 mv pk?pk, r l = 16 , g = 1 (0 db) figure 36. psrr ? input grounded with 10 v p = 2.4 v, v ripple = 200 mv pk?pk, r l =16 , g = 1 (0 db) and g = 4 (12 db) figure 37. psrr ? input grounded with 10 v p = 5.0 v, v ripple = 200 mv pk?pk, r l = 16 , g = 1 (0 db) and g = 4 (12 db) ncp2809b ncp2809b g = 4 g = 1 g = 4 g = 1 ncp2809b ncp2809b
ncp2809 series http://onsemi.com 13 typical characteristics figure 38. turningon time/v p = 5.0 v and f = 100 hz ch1 = out_r, ch2 = vmc and ch3 = shutdown figure 39. turningon time zoom/v p = 5.0 v and f = 400 hz ch1 = out_r, ch2 = vmc and ch3 = shutdown figure 40. turningoff time/v p = 5.0 v and f = 100 hz ch1 = out_r, ch2 = vmc and ch3 = shutdown figure 41. turningoff time zoom/vp = 5.0 v and f = 400 hz ch1 = out_r, ch2 = vmc and ch3 = shutdown
ncp2809 series http://onsemi.com 14 application information detailed description the ncp2809 power audio amplifier can operate from 2.6 v to 5.0 v power supply. it delivers 24 mw rms output power to a 16 load (v p = 2.4 v) and 131 mw rms output power to a 16 load (v p = 5.0 v). the structure of ncp2809 is basically composed of two identical internal power amplifiers; ncp2809a has a fixed internal gain of 0 db and the gain can be set externally with the ncp2809b. internal power amplifier the output p mos and n mos transistors of the amplifier are designed to deliver the specified output power without clipping. the channel resistance (r on ) of the n mos and p mos transistors does not exceed 3.0 when driving current. the structure of the internal power amplifier is composed of three symmetrical gain stages, first and medium gain stages are transconductance gain stages in order to maximize bandwidth and dc gain. turn?on and turn?off transitions a turn?on/off transition is shown in the following plot corresponding to curves in figures 38 to 41. in order to eliminate apop and clicko noises during transitions, output power in the load must be slowly established or cut. when logic high is applied to the shutdown pin, the bypass voltage begins to rise exponentially and once the output dc level is around the common mode voltage, the gain is established slowly (50 ms). this way to turn?on the device is optimized in terms of rejection of apop and clicko noises. the device has the same behavior when turned?off by a logic low on the shutdown pin. during the shutdown mode, amplifier outputs are connected to the ground. a theoretical value of turn?on and off times at 25 c is given by the following formula. c by : bypass capacitor r: internal 300 k resistor with a 25% accuracy t on = 0.95 * r * c by t off = r * c by * ln(v p /1.4) shutdown function the device enters shutdown mode when shutdown signal is low. during the shutdown mode, the dc quiescent current of the circuit does not exceed 600 na. current limit protection circuitry the maximum output power of the circuit (p orms = 135 mw, v p = 5.0 v, r l = 16 ) requires a peak current in the load of 130 ma. in order to limit excessive power dissipation in the load when a short?circuit occurs, the current limit in the load is fixed to 250 ma. the current in the output mos transistors is real?time monitored, and when exceeding 250 ma, the gate voltage of the corresponding mos transistor is clipped and no more current can be delivered. thermal overload protection circuitry internal amplifiers are switched off when temperature exceeds 160 c, and will be switched back on only when the temperature goes below 140 c. ncp2809 is a stereo power audio amplifier. if the application requires a single ended topology with output coupling capacitors, then the current provided by the battery for one output is as following: ? v o (t) is the ac voltage seen by the load. here we consider a sine wave signal with a period t and a peak voltage v o . ? r l is the load. t time t/2 v o /r l i p (t) so, the total power delivered by the battery to the device is: p tot v p i p avg i p avg 1 2 0 v o r l sin(t)dt v o .r l p tot v p .v o .r l the power in the load is p out . p out v o 2 2r l
ncp2809 series http://onsemi.com 15 the dissipated power by the device is p d p tot p out p d v o r l v p v o 2 at a given power supply voltage, the maximum power dissipated is: p dmax v p 2 2 2 .r l of course, if the device is used in a typical stereo application, each load with the same output power will give the same dissipated power. thus the total lost power for the device is: p d v o r l 2v p v o and in this case, the maximum power dissipated will be: p dmax v p 2 2 .r l in single ended operation, the efficiency is: .v o 2v p if the application requires a nocap scheme without output coupling capacitors, then the current provided by the battery for one output is as following: ? v o (t) is the ac voltage seen by the load. here we consider a sine wave signal with a period t and a peak voltage v o . ? r l is the load. t time t/2 v o /r l i p (t) so, the total power delivered by the battery to the device is: p tot v p i p avg i p avg 1 0 v o r l sin(t)dt 2v o .r l p tot 2v p .v o .r l the power in the load is p out p out v o 2 2r l the dissipated power by the device is p d p tot p out p d v o r l 2v p v o 2 at a given power supply voltage, the maximum power dissipated is: p dmax 2v p 2 2 .r l of course, if the device is used in a typical stereo application, each load with the same output power will give the same dissipated power. thus the total lost power for the device is: p d v o r l 4v p v o and in this case, the maximum power dissipated will be: p dmax 4v p 2 2 .r l in nocap operation, the efficiency is: .v o 4v p gain?setting selection with ncp2809 audio amplifier family, you can select a closed?loop gain of 0db for the ncp2809a and an external gain setting with the ncp2809b. in order to optimize device and system performance, ncp2809 needs to be used in low gain configurations. it minimizes thd+n values and maximizes the signal?to?noise ratio, and the amplifier can still be used without running into the bandwidth limitations. ncp2809a can be used when a 0 db gain is required. adjustable gain is available on ncp2809b.
ncp2809 series http://onsemi.com 16 ncp2809 amplifier external components input capacitor selection (c in ) the input coupling capacitor blocks the dc voltage at the amplifier input terminal. this capacitor creates a high?pass filter with the internal r internal resistor of 50 k , the cut?off frequency of which is given by: f c 1 2* *r in *c in (eq. 1) the size of the capacitor must be large enough to couple in low frequencies without severe attenuation. however a large input coupling capacitor requires more time to reach its quiescent dc voltage (v p /2) and can increase the turn?on pops. an input capacitor value of 100 nf performs well in many applications (with r internal =50 k ). bypass capacitor selection (c bypass ) the bypass capacitor c by provides half?supply filtering and determines how fast the ncp2809 turns on. a proper supply bypassing is critical for low noise performance and high power supply rejection ratio. moreover, this capacitor is a critical component to minimize the turn?on pop noise. a 1.0 f bypass capacitor value should produce clickless and popless shutdown transitions. the amplifier is still functional with a 0.1 f capacitor value but is more sensitive to apop and clicko noises. thus, for optimized performances, a 1.0 f ceramic bypassing capacitor is recommended. without output coupling capacitor as described in figure 42, the internal circuitry of the ncp2809 device eliminates need of heavy bypassing capacitors when connecting a stereo headset with 3 connecting points. this circuitry produces a virtual ground and does not affect either output power or psrr. additionally, eliminating these capacitors reduces cost and pcb place. however, user must take care to the connection between pin ref_i and ground of the headset: this pin is the ground reference for the headset. so, in order to improve crosstalk performances, this pin must be plugged directly to the ground pin of the headset connector. with output coupling capacitor however, when using a low cost jack connector (with third connection to ground), the headset amplifier requires very few external components as described in figure 43. only two external coupling capacitors are needed. the main concern is in output coupling capacitors, because of the value and consequently the size of the components required. purpose of these capacitors is biasing dc voltage and very low frequency elimination. both, coupling capacitor and output load form a high pass filter. audible frequency ranges from 20 hz to 20 khz, but headset used in portable appliance has poor ability to reproduce signals below 75 or 100 hz. input coupling capacitor and input resistance also form a high pass filter. these two first order filters form a second order high pass filter with the same ?3 db cut off frequency. consequently, the following formula must be respected: 1 2 50 k c in 1 2 r l c out (eq. 2) like for loudspeaker amplifier, the input impedance value for calculating filters cut off frequency is the minimum input impedance value at maximum output volume. to obtain a frequency equal to when frequency is 5 times the cut off frequency, attenuation is 0.5 db. so if we want a 0.5 db at 150 hz, we need to have a 3 db cut off frequency of 30 hz: f? 3db 1 2 r l c out (eq. 3) c out 1 2 r l f? 3db (eq. 4) with r l = 16 , and f ?3db = 30 hz formula (4) shows that c out 330 f. with c out = 220 f, 0.5 db attenuation frequency will be 225 hz with a 3.0 db cut off frequency of 45 hz. following this, the input coupling capacitor choice is straightforward. using formula (2) input coupling capacitor value would be 68 nf for a 220 f output coupling capacitor and 100 nf for a 330 f output coupling capacitor. when using the ncp2809 with this configuration, pins ref_i and out_i must be left unconnected (see figure 43).
ncp2809 series http://onsemi.com 17 figure 42. typical application schematic without output coupling capacitor + - + - + - 16 16 out_l ref_i out_r 20 k 20 k bypass 1 fc s v p v p + ? + ? shutdown control 20 k 20 k v m c bypass 1 f v p v mc bridge bypass shutdown in_r in_l 390 nf c i 390 nf c i v ih v il audio input audio input out_i figure 43. typical application schematic with output coupling capacitor + - + - + - 16 16 out_l ref_i out_r 20 k 20 k bypass 1 fc s v p v p + ? + ? shutdown control 20 k 20 k v m c bypass 1 f v p v mc bridge bypass shutdown in_r in_l 390 nf c i 390 nf c i v ih v il audio input audio input nc nc 220 f c out 220 f c out + + out_i
ncp2809 series http://onsemi.com 18 demonstration board and layout guidelines + - + - + - 16 16 out_r ref_i out_l 20 k 20 k bypass 1 fc1 v p v p + ? + ? shutdown control 20 k 20 k v m 1 f v p v mc bridge bypass shutdown in_l in_r 390 nf c2 390 nf c4 j3 & u2 10 8 4 6 u1 1 2 3 1 3 2 1 3 2 7 vm1 vm1 vm1 1 3 5 2 j2 j4 v p vm1 c3 vm1 vm1 9 v p 100 k r1 j1 + - + - + - 16 16 out_r ref_i out_l 20 k 20 k bypass 1 fc5 v p v p + ? + ? shutdown control 20 k 20 k v m 1 f v p v mc bridge bypass shutdown in_l in_r 390 nf c6 390 nf c8 j9 & u4 10 8 4 6 u3 1 2 3 1 3 2 1 3 2 7 vm2 vm2 vm2 1 3 5 2 j8 j10 v p vm2 c7 vm2 vm2 9 v p 100 k r2 j7 vm2 vm2 220 f 220 f c9 c10 nc nc + + figure 44. schematic of the demonstration board for micro10 device out_i out_i
ncp2809 series http://onsemi.com 19 bottom layer top layer figure 45. demonstration board for micro10 device pcb layers
ncp2809 series http://onsemi.com 20 table 1. bill of material item part description ref. pcb footprint manufacturer manufacturer reference 1 ncp2809 audio amplifier u1,u3 micro10 on semiconductor ncp2809 2 smd resistor 100 k r1,r2 0805 vishay?draloric d12crcw series 3 ceramic capacitor 390 nf 50 v z5u c2,c4, c6,c8 1812 kemet c1812c394m5uac 4 ceramic capacitor 1.0 f 16 v x7r optimized performance c1,c3, c5,c7 1206 murata grm42?6x7r105k16 5 tantalum capacitor 220 f 10 v c9,c10 ? kemet t495x227010as 6 i/o connector. it can be plugged by blz5.08/2 (weidmller reference) j4,j10 ? weidmller sl5.08/2/90b 7 i/o connector. it can be plugged by blz5.08/3 (weidmller reference) j2,j3, j8,j9 ? weidmller sl5.08/3/90b 8 3.5 mm pcb jack connector u2,u4 ? decelect?forgos ies 101?3 9 jumper header vertical mount 2*1, 2.54 mm j1,j7 ? ? ? pcb layout guidelines how to optimize the accuracy of vmc the main innovation of the ncp2809 stereo nocap audio amplifier is the use of a virtual ground that allows connecting directly the headset on the outputs of the device saving dc?blocking output capacitors. in order to have the best performances in terms of crosstalk, noise and supply current, the feedback connection on the virtual ground amplifier is not closed internally. to reach this goal of excellence, one must connect out_i and ref_i as close as possible from the middle point of the output jack connector. the most suitable place for this connection is directly on the pad of this middle point. how to optimize thd+n performances to get the best thd+n level on the headset speakers, the traces of the power supply, ground, out_r, out_l and out_i need the lowest resistance. thus, the pcb traces for these nets should be as wide and short as possible. you need to avoid ground loops, run digital and analog traces parallel to each other. due to its internal structure, the amplifier can be sensitive to coupling capacitors between ground and each output (out_r, out_l and out_i). avoid running the output traces between two ground layers or if traces must cross over on different layers, do it at 90 degrees. ordering information device marking package shipping 2 ncp2809admr2 mae micro10 4000 t ape & reel ncp2809bdmr2 mac micro10 4000 tape & reel NCP2809BDMR2G mac micro10 (pb?free) 4000 tape & reel 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
ncp2809 series http://onsemi.com 21 package dimensions micro10 dm suffix case 846b?03 issue c scale 8:1 10x 10x 8x 1.04 0.041 0.32 0.0126 5.28 0.208 4.24 0.167 3.20 0.126 0.50 0.0196 mm inches
s b m 0.08 (0.003) a s t dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 0.95 1.10 0.037 0.043 d 0.20 0.30 0.008 0.012 g 0.50 bsc 0.020 bsc h 0.05 0.15 0.002 0.006 j 0.10 0.21 0.004 0.008 k 4.75 5.05 0.187 0.199 l 0.40 0.70 0.016 0.028 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension aao does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension abo does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. 846b?01 obsolete. new standard 846b?02 ?b? ?a? d k g pin 1 id 8 pl 0.038 (0.0015) ?t? seating plane c h j l *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
ncp2809 series http://onsemi.com 22 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 ncp2809/d nocap is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.

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